Photo-Etching, electrocasting and punching for thin plate by Meltec

Meltec Corporation

1038 Nagareyama, Nagareyama city, Chiba, 270-0164
TEL:+814-7178-8800
FAX:+814-7178-8801

HOME＞Photo-Etching

Pattern is made on the thin metal plate by chemical method etching (Through hole or half etching).
Low initial cost, quick delivery and no burr/mechanical stress/work hardening.
Additional process such as coating, black oxide finish, electropolishing, bending and insert moliding etc. is also available.

shim and spacer

Beryllium copper heat treated products

Mesh and madreporic plate

Etching for aluminum plate

Technology highlights

t=0.005 to t=1.0, max size 600×1100
t≦ stamping out width (Generally more than 1.5 times of thickness)Minimum stamping out with for mass production is around 0.07.
t≧ remaining width（Minimum width is 70％ of thickness）
Various process : both sides etching, one side etching and half etching.
For beryllium copper, in-house production from rust, prevention of discoloration to heat treatment is available.
High flatness of Be-Cu can be kept even after heat treatment.

Processible materials

SUS, copper, nickel, alminium, nichrome, titanium, molybdenum,　hastelloy etc.

Material thickness（t）	Miin. stamping out width（D）	Min. remaining width
Less than t=0.05	To be decided according to trial process.	To be decided according to trial process.
t=0.05	t×150％	t×around 70％

Side edge（S）
Normal etching	Under etching	Over etching
t×10-20％	t×15-30％	t× around -5％

Additional process a la carte

Diffusion bonding/bending/insert molding/spot welding/coating/black oxide finish/electro polishing/rolling
/heat treatment/thermocompression/adhesion/design and making of a die

In-house production for all the processes is possible.