HOME＞Jig for semiconductor manufacture and additional process
Internal integrated production from design support/die making to final product is possible.
Technology highlights
- Design support: CAD drawing prepared from product drawing.
- Die making: for stamping/bending
- Etching
- Stamping: for stamping/bending
- Edge face finishing: barrel-polishing/shaving treatment
- Spot-welding
- Thermo compression (Diffusion bonding)
- Umber(Inver) is available from our standing inventory.
- Others: plate processing/DLC coating
Ancillary process a la carte
In-house production of all the process is possible.
Diffusion bonding/punching(bending work)/insert molding/spot welding/plating/black oxide finish(metal)/rolling/heat treatment/adhesion/design and making of a die.
Spot welding/rolling/bending
Miini etching product with bending
Rigitaized screen
Rigitaized screen is a mesh screen which intersection of SUS meshu is
fixed by Ni coating.
Screen life will be improved dramatically.
Pitch expansion and contraction problem will be solved.
